Product Name : Flip Chip Packing Automatic Cleaning Machine
Products

Flip Chip Packing Automatic Cleaning Machine capability profile

  •  Make to Cheng to high plumbous protruding one of bump, need to use welding stronger water-washing and helping the solder flux , prevent bump cold welding from causing and keeping in touch badly , so need to use and help welding the washing machine, will have water-washing and helping the solder flux to wash of corrosively.

Flip Chip Packing Automatic Cleaning Machine specifications form

According your products requirement to manutacturing equipment

Model

UPH

(unit: mm)

Machine Size

 (unit: meter)

power consumption

(KVA)

FC-07

Depend on the product design

L5.55x W3.48 xH2.235

76.5

Power

AC 220V / 380V /415V  3P4W  50HZ/60HZ