Flip Chip Packing Automatic Cleaning Machine

Flip Chip Packing Automatic Cleaning Machine capability profile

•  Make to Cheng to high plumbous protruding one of bump, need to use welding stronger water-washing and helping the solder flux , prevent bump cold welding from causing and keeping in touch badly , so need to use and help welding the washing machine, will have water-washing and helping the solder flux to wash of corrosively.

Flip Chip Packing Automatic Cleaning Machine specifications form

According your products requirement to manutacturing equipment